Long-Term Semiconductor Strategy is Set in Thailand泰國半導體長期戰略已定

On 7 January 2026, the Deputy Prime Minister and Minister of Finance, Mr. Ekniti Nitithanprapas announced that the Thai government has set out a national strategy to expand the semiconductor industry, focusing on power semiconductors, sensors, photonics, discrete devices and analog chips, as part of a long-term plan to build a complete value chain. The committee reviewed the Draft National Semiconductor and Advanced Electronics Strategy which was prepared by the Thailand Board of Investment (BOI). The draft sets phased development targets for 2030, 2040 and 2050.

副總理兼財政部長 Ekniti Nitithanprapas 先生於2026 年 1 月 7 日宣布，泰國政府已制定一項擴展半導體產業的國家戰略。該戰略重點發展功率半導體、感測器、光子學、分離式元件以及類比晶片，並作為構建完整價值鏈長期計畫的一部分。委員會已審查由泰國投資促進委員會(BOI)所擬定的《國家半導體與先進電子產業戰略草案》，該草案設定 2030 年、2040 年及 2050 年的分階段發展目標。

Under the strategy, Thailand will prioritize power, sensor, photonics, discrete and analog semiconduc-tors, which are closely connected to the country’s established electronics manufacturing base and supply chains serving the automotive, energy, data center and industrial sectors. Demand for these chips is being driven by electric vehicles, renewable energy systems, artificial intelli-gence infrastructure and smart manufacturing, where Thailand hosts major global manu-facturers in these fields.

泰國在此戰略下將優先發展功率半導體、感測器、光子學、分離式元件及類比晶片。這些領域與泰國現有的電子製造基地，以及服務於汽車、能源、數據中心和工業部門的供應鏈緊密相連。上述晶片的需求主要由電動車、再生能源系統、人工智慧基礎設施及智慧製造所驅動，而泰國在這些領域早已聚集多家全球主要的製造商。

In short term, the strategy will focus on expanding areas where Thailand already has competitive advantages, including semiconductor assembly and testing, integrated circuit design and advanced electronics manufacturing, while encouraging investment in upstream activities such as wafer fabrica-tion and supporting the emergence of local champions in the industry. In the longer term, the goal is to attract more than 2.5 trillion baht ($79 billion) in investment by 2050, training more than 230,000 skilled workers, and create a complete semiconductor ecosystem, supporting the production of “Made-in-Thailand” chips and strengthening the country’s regional position.

該戰略在短期內將聚焦於擴大泰國已具備競爭優勢的領域，包括半導體封裝測試、積體電路設計以及先進電子製造，同時鼓勵對晶圓代工等上游活動的投資，並支持本土領軍企業的崛起。長期而言，其目標是到 2050 年吸引超過 2.5 兆泰銖(約 790 億美元)的投資，培訓超過 23 萬名技術人員，並建立一個完整的半導體生態系統，以支持「泰國製造」晶片的生產，進而強化該國在區域中的地位。

Specifically during the first five years, the strategy will build on Thailand’s existing strengths in outsourced semiconductor assembly and testing (OSAT), integrated circuit (IC) design, and advanced electronics manufacturing, while actively promoting investment in upstream wafer fabrication in Thailand. In parallel, the government will begin nurturing high-potential Thai companies to grow into future local champions in the semiconductor industry.

具體而言，在最初的五年內，該戰略將立足於泰國現有的優勢領域，包括半導體委外封測(OSAT)、積體電路(IC)設計以及先進電子製造，同時積極推動在泰國境內的上游晶圓代工投資。與此同時，政府將開始培育具備高潛力的泰國公司，使其成長為半導體產業未來的本土領軍企業。

The strategy is supported by incentives and policy measures covering investment, talent, technology, infrastructure and the business environment. These include financial support for capital expenditure and research and development, and expanded workforce development programs delivered through partnerships with international universities and visa schemes. National research infrastructure, including facilities for front-end research, strengthening intellectual property protection, and promoting joint research between universities, startups and industry is also included under the strategy.

該戰略由一系列誘因與政策措施支撐，範圍涵蓋投資、人才、技術、基礎設施及商務環境。具體措施包括對資本支出與研發的資金支持，並透過與國際大學合作及簽證計畫擴大勞動力培訓方案。此外，該戰略也納入國家級研究基礎設施，包含前瞻研發設施、加強智慧財產權保護，以及促進大學、新創企業與產業間的聯合研究。

To meet these goals, the draft proposes five main mechanisms, including:

為了達成上述目標，草案提出五大主要機制，包括：

Incentives: Long-term low-interest loans and financial grants to lure major global players.

激勵措施：提供長期低利貸款與財政補助，以吸引全球大型企業進駐。

Human Capital: Training 230,000 highly skilled engineers through partnerships with international universities, to develop semiconductor engineering talent and advanced research capabilities, as well as to upskill the workforce through specialised vocational and professional training programs.

人力資本： 透過與國際大學合作，預計培育 23 萬名高階工程人才，旨在開發半導體工程人才與先進研究能力，並透過專門的職業與專業培訓計畫，提升現有勞動力的技能。

Technology: Upgrading the Microelectronics Technology Centre (TMEC) and fostering state-private R&D.

技術：升級微電子技術中心(TMEC)，並促進政府與民間的聯合研發。

Infrastructure: Developing specialised industrial clusters with guaranteed clean energy and water security.

基礎設施：開發專門的產業聚落，並確保綠色能源與水資源供應的安全。

Business Ecosystem: Streamlining regulatory approvals and negotiating semiconductor-specific trade agreements with the UK, US, and EU.

商業生態系統： 精簡法規審批流程，並與英國、美國及歐盟協商針對半導體產業的貿易協定。

The BOI agreed that foreign investment attraction should go hand-in-hand with strengthening Thai participation in the semiconductor value chain to drive technology transfer and develop Thai businesses into future local champions.

BOI一致認為，吸引外資應與強化泰國企業在半導體價值鏈的參與度並行，以驅動技術轉移，並將泰國本土企業培養成未來的領軍企業。

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